Description:
BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. These Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip applications are made by the UMT ( Ultra Micron Technology) to ensure spheres with accurate diameters, bright, shiny surface finishes; and high sphericity.
Packaging:
Features:
| Diameter | 0.64mm |
| Tolerance | ±20um |
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