Shenmao BGA Solder Spheres-SAC305. Solder Spheres are for PBGA, CBGA, TBGA, CSP and Flip Chip applications.
A Shenmao BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. It was developed and produced under a strict research and quality control policy.
The Solder Spheres are for PBGA, CBGA, TBGA, CSP and Flip Chip applications and are made by the UMT ( Ultra Micron Technology) to ensure spheres with accurate diameters, bright, shiny surface finishes; and high sphericity. They have their own developed technology which reduces raw material cost, accordingly competitive price make users benefit.
We can supply customer’s request of various sizes and customer specifications of BGA Spheres.
Call 866-434-7561 to speak with one of our knowledgable sales engineers today!
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